Inspectis 90º Side-View BGA Standard Probe Tip for Precision Optical Inspection

The Inspectis 90º Side-View BGA Standard Probe Tip (BGA-006) is a precision optical accessory engineered for seamless integration with the Inspectis 90º Side-View BGA Standard Lens. It provides high-resolution imaging of hidden solder joints beneath Ball Grid Arrays (BGA), Micro-BGA (µBGA), Chip Scale Packages (CSP), and other surface-mounted devices (SMD). This probe is essential for detailed side-view inspection of under-component interfaces that are frequently inaccessible by conventional top-down microscopy techniques.

Technical specifications include:

• Part Number/SKU: BGA-006 (Standard) and BGA-006-XM (Extended Magnification)
• Optical Probe Tip Thickness: approximately 1.8 mm
• Optical Probe Tip Width: approximately 6.6 mm
• Probe Tip Footprint: approximately 0.85 × 6.6 mm
• Required Free Working Area: approximately 1.0 mm
• Compatibility: Designed specifically for the Inspectis 90º Side-View BGA Standard Lens, compatible with other BGA inspection systems
• Manufacturing Origin: Sweden
• Warranty: 2-year limited manufacturer warranty
• Return Policy: Non-returnable
• Estimated Delivery: 3–4 weeks

Key features:

• _Side-View Optical Access:_ Allows detailed visualization of solder joints and hidden geometries beneath BGAs and similar packages.
• _Standard and Extended Magnification Options:_ Accommodates various inspection requirements in electronics quality control and failure analysis workflows.
• _Slim Profile:_ Thin optical probe tip enables access to tight stand-off heights commonly found in advanced semiconductor packaging.
• _Industrial-Grade Durability:_ Built to withstand repetitive use in demanding electronics inspection environments.
• _Critical Electronics Quality Control Tool:_ Widely used by inspection technicians to ensure solder joint integrity in assembly, rework, and biomanufacturing of electronic components.

This optical probe tip is ideal for research and industrial settings involved in biotechnology device manufacturing, advanced electronics diagnostics, and molecular diagnostics instrumentation where reliable side-view imaging of microelectronic assemblies is crucial. It supports workflows in bioprocessing equipment development, ensuring solder joint quality in critical components of biomedical engineering devices.