Inspectis 90º Side-View BGA Standard Lens for Optical Microscope Systems

The Inspectis Microscope 90º Side-View BGA Standard Lens is an advanced optical microscope accessory engineered for precision inspection of Ball Grid Array (BGA) and chip components. Specifically designed for integration with Inspectis BGA microscope systems like BGA ProX and BGA Basics, this lens allows visualization of hidden solder joints and underside surfaces inaccessible to traditional top-view optics, essential for accurate quality control in electronics and molecular diagnostics workflows involving PCB assembly.

Key technical specifications include:

• Magnification Range (Standard Lens): approximately 36× to 300× on a 28″ monitor, enabling detailed imaging down to 40 µm stand-off height.
• Working Distance: flexible focusing range from 0.5 mm up to 100 mm supports various inspection set-ups.
• Field of View: 2 mm to 16.5 mm allows inspection of diverse chip sizes including FlipChip, BGA, µBGA, CGA, CSP, and SMD devices.
• Optical Quality: precision Swedish-manufactured optics ensure reliable image clarity and durability suitable for biomanufacturing and advanced electronics inspection environments.
• Side-View 90º Design: critically enables access to underside solder joints vital for molecular diagnostics instrumentation and synthetic biology device production.
• Part Numbers Available: BGA-004 (Standard) and BGA-004-XM (Extended Magnification option with 55×–370× zoom and shorter working distance).
• Additional Features: 2-year limited warranty, typical 3–4 week delivery lead time, non-returnable.

This lens is widely used in biotechnology and electronics research sectors focusing on bioprocessing instrumentation, gene editing device inspection, and synthetic biology manufacturing lines. Its ability to deliver high-resolution side-view imaging makes it a critical tool for molecular cloning workflows and quality assurance in biopharmaceutical production pipelines. The Inspectis BGA lens is an indispensable optical solution for scientists and engineers requiring precise solder joint analysis on complex chip packages.