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Disco DFD6341 Fully Automatic Dual Spindle Dicing Saw for Semiconductor Wafers


Product Description

The Disco DFD6341 is a fully automatic dual spindle dicing saw engineered for precise semiconductor wafer processing. Designed to handle wafers up to Φ8 inches, it integrates advanced technology from the DFD6362 series to significantly increase throughput and efficiency in semiconductor manufacturing and biotechnology applications such as molecular diagnostics and synthetic biology workflows.

Key technical features include:

  • Dual spindle system enabling simultaneous cutting for enhanced productivity
  • X-axis return speed up to 1,000 mm/s with rapid acceleration and deceleration, optimizing processing time for high-volume biomanufacturing environments
  • Compact footprint with a space-saving design reducing the equipment size by 3% compared to previous models
  • User interface featuring an intuitive LCD touch panel GUI for precise control and ease of operation during complex dicing tasks
  • Optional high-speed flash alignment technology to reduce wafer alignment time, critical for workflows demanding high precision and yield

Specifications:

  • Power: 200–240 V, 50/60 Hz operation suitable for global laboratory settings
  • Cutting ranges: X-axis 210 mm, Y1/Y2 axes 210 mm
  • Cutting speed range: 0.1 to 1,000 mm/s with an index step resolution of 0.0001 mm ensuring high positioning accuracy within 0.002/210 mm
  • Z-axis stroke maximum 19.22 mm adaptable to various blade types (Φ2 inch blade) with high moving resolution of 0.00005 mm
  • Precision spindle with rated torque of 0.19 N·m supporting speeds between 6,000 and 60,000 min⁻¹ (1.2 kW/1.8 kW motors) offering flexibility for diverse material cutting requirements
  • Dimensions: 1,180 × 1,080 × 1,820 mm; weight approx. 1,500 kg, ideal for specialized production lines where space and efficiency are prioritized

This dicing saw is critical in semiconductor wafer dicing and widely adopted in biotechnology research environments where precise, high-throughput cutting is essential for bioprocessing, gene editing chip fabrication, and synthetic biology device production. Its high repeatability accuracy (0.001 mm) supports rigorous quality control standards required in molecular biology and clinical diagnostics laboratories.

The Disco DFD6341 system exemplifies advanced automation essential for scalable biopharmaceutical production pipelines, facilitating rapid and precise wafer segmentation for various downstream applications.


Item Stats

Status
For Sale
State
used
Brand
Disco co.
Model
DFD6341
Location
United States

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