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Hamamatsu ImagEM X2-1K Electron Multiplying Back-Thinned EM CCD Camera C9100-24B
Product Description
The Hamamatsu ImagEM X2-1K (model C9100-24B) is a high-sensitivity back-thinned electron multiplying CCD camera designed for quantitative ultra-low light imaging. It features:
- Imaging device: Electron Multiplying Back-Thinned Frame Transfer CCD
- Effective pixels: 1024 × 1024, pixel size 13 μm × 13 μm
- Full well capacity: Up to 400,000 electrons (EM-CCD readout), max 800,000 electrons (not linear above 400,000)
- EM gain range: 1×, 10× to 1200× typical
- Frame rates: 18.5 fps (full frame) up to 314 fps (binned/sub-array)
- Readout noise: As low as 1 electron rms (EM gain 1200×), varies with pixel clock rates
- Cooling: Hermetic vacuum-sealed head with forced-air or water cooling achieving temperatures down to -80 °C
- Dark current: Extremely low, 0.01 electron/pixel/s at -65 °C (air cooled), 0.001 electron/pixel/s at -80 °C (water cooled)
- Exposure time range: Internal sync 52.7 ms to 2 h, external trigger 10 μs to 2 h
- Connectivity: IEEE1394b interface for data and control
- Special features: On-board EM gain protection, multiple external trigger modes, lens mount C-mount, multiple real-time image processing options (background subtraction, shading correction, recursive filtering, frame averaging, spot noise reduction)
- Physical: Hermetic vacuum-tight camera head maintains 10^-8 Torr without re-evacuation
- Power: AC 100–240 V, 50/60 Hz, ~140 VA consumption
- Operating environment: 0 °C to 40 °C, 70% max humidity, no condensation
The camera delivers maximum speed and precision for advanced scientific imaging in near-dark conditions, long integration, or high-speed acquisition scenarios.
Item Stats
Product details
| Type number | C9100-24B |
| Camera head type | Hermetic vacuum-sealed air/water-cooled head*1 |
| Window | Anti-reflection (AR) coatings on both sides, single window |
| AR mask | No |
| Imaging device | Electron Multiplying Back-Thinned Frame Transfer CCD |
| Effective number of pixels | 1024 (H)×1024 (V) |
| Cell size | 13 μm (H)×13 μm (V) |
| Effective area | 13.3 mm (H) × 13.3 mm (V) |
| Pixel clock rate (EM-CCD readout) | 22 MHz, 11 MHz, 0.6875 MHz |
| Pixel clock rate (NORMAL CCD readout) | 0.6875 MHz |
| EM (electron multiplying) gain | 1×, 10× to 1200× (typ.)*2 |
| Ultra low light detection | Photon Imaging mode (1, 2, 3) |
| Fastest readout speed | 18.5 frames/s to 314 frames/s*3 |
| Readout noise (EM-CCD readout) | 15 electrons (EM gain 4×, at 22 MHz) (rms) (typ.)10 electrons (EM gain 4×, at 11 MHz) (rms) (typ.)3 electrons (EM gain 4×, at 0.6875 MHz) (rms) (typ.)1 electron max. (EM gain 1200×） (rms) (typ.) |
| Readout noise (NORMAL CCD readout) | 10 electrons (at 0.6875 MHz) (rms) (typ.) |
| Full well capacity | EM-CCD readout: 400 000 electrons (Max. 800 000 electrons) (typ.)*4NORMAL CCD readout: 50 000 electrons (typ.) |
| Analog gain | EM-CCD readout (22 MHz): 1×EM-CCD readout (11 MHz/0.6875 MHz): 0.5×, 1×Normal CCD readout: 1×, 2×, 3×, 4×, 5× |
| Cooling temperature (Forced-air cooled) | At temperature control: -50 ℃ (Room temperature 0 ℃ to +30 ℃, at 22 MHz)At temperature control: -55 ℃ ((Room temperature 0 ℃ to +30 ℃, 11 MHZ, 0.6875 MHz. Normal CCD readout)At maximum cooling (typ.): -65 ℃ (Room temperature: stable at +20 ℃) |
| Cooling temperature (Water cooled) | At temperature control: -65 ℃ (Water temperature: +20 ℃, at 22 MHz)At temperature control: -70 ℃ (Water temperature: +20 ℃, 11 MHZ, 0.6875 MHz. Normal CCD readout)At maximum cooling (typ.): -80 ℃ (Water temperature: lower than +10 ℃) |
| Temperature stability (Forced-air cooled) | ±0.01 ℃ (typ.) |
| Temperature stability (Water cooled) | ±0.01 ℃ (typ.) |
| Dark current (Forced-air cooled) | 0.01 electron/pixel/s (-65 ℃) (typ.) |
| Dark current (Water cooled) | 0.001 electron/pixel/s (-80 ℃) (typ.) |
| Clock induced charge | 0.01 events/pixel/frame (typ.) |
| Exposure time (Internal sync mode) | 52.7 ms to 1 s (22 MHz)103.2 ms to 2 h (11 MHz)1616.9 ms to 2 h (0.6875 MHz) |
| Exposure time (External trigger mode) | 10 μs to 1 s (22 MHz)10 μs to 2 h (11 MHz, 0.6875 MHz) |
| A/D converter | 16 bit |
| Output signal/External control | IEEE1394b |
| Sub-array | Every 16 lines (horizontal, vertical) size, position can be set |
| Binning | 2×2, 4×4 |
| External trigger mode | Edge trigger, Level trigger, Start trigger, Synchronous readout trigger |
| Trigger output | Exposure timing output, Programmable timing output (Delay and pulse length are variable.), Trigger ready output |
| Image processing features (real-time) | Background subtraction, Shading correction, Recursive filter, Frame averaging, Spot noise reducer*5 |
| EM gain protection | EM warning mode, EM protection mode |
| EM gain readjustment | Available |
| Lens mount | C-mount |
| Power supply | AC 100 V to 240 V, 50 Hz / 60 Hz |
| Power consumption | Approx. 140 VA |
| Ambient storage temperature | -10 °C to + 50 °C |
| Ambient operating temperature | 0 °C to + 40 °C |
| Performance guaranteed temperature | 0 °C to + 30 °C |
| Ambient operating/storage humidity | 70 % max. (with no condensation) |
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