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Inspectis BGA-Basics Side-View Optical Inspection Microscope for Solder Joint Analysis
Product Description
The Inspectis BGA-Basics is an advanced side-view optical inspection system designed specifically for detailed BGA solder joint analysis and quality control in electronics manufacturing and laboratory research. This professional-grade inspection microscope features a 5.0 MP USB3.0 digital camera paired with precision optics, enabling high-resolution imaging of solder joints and components including BGA, µBGA, CSP, CGA, FlipChip, and top-view SMDs.
Key technical specifications include:
- Optical magnification: Approximately 25× to 200× on a 24″ monitor with a working distance of 0.5–25 mm
- Imaging sensor: 1/2.5″ CMOS, 5 MP (2592 × 1944 pixels), 2.2 µm pixel size
- Camera control: Auto/manual exposure, white balance, contrast, brightness, gamma, sharpness, HDR, and frame stacking
- Illumination: High-power pure white LED with microprism technology and an additional LED gooseneck brush light with electronic intensity control
- Measurement & documentation: INSPECTIS® BGA Basics software supports live imaging, image capture, distance measurement, and advanced camera controls for efficient workflows
- Durability & ESD protection: Antistatic coated stand with large base, ±90° pivot for probe positioning, grounded points on stand and optional XY stage to prevent electrostatic discharge damage
- System dimensions and weight: Approximately 400 × 295 × 385 mm and 9.2 kg
- Operating environment: Temperature range −20 °C to +60 °C with 20–95% relative humidity, non-condensing
- Included accessories: Dedicated computer, 27″ UHD/4K monitor (3840 × 2160), and aluminum carrying case
The Inspectis BGA-Basics is essential for molecular diagnostics, biotechnology process control, and biomedical engineering laboratories engaged in bioprocessing and fine-pitch PCB inspection. Its advanced camera system and integrated illumination provide critical imaging capabilities for synthetic biology research and gene editing workflows where reliable solder joint quality affects downstream device performance. Widely adopted in electronics manufacturing QA and laboratory analytics, this turnkey solution enables precise inspection and documentation of hidden defects in complex semiconductor packages.
This system combines ergonomic design with robust technical features, supporting detailed fluorescence analysis in bioengineering settings and biopharmaceutical production pipelines requiring stringent quality assessment of electronic components within medical devices. The Inspectis BGA-Basics fosters reproducible, high-resolution imaging essential for cell imaging device manufacturing and advanced live-cell imaging equipment quality assurance.
Primary keywords: BGA inspection microscope, side-view optical inspection, solder joint analysis, precision digital microscope
Long-tail keywords: detailed BGA solder joint imaging, high-resolution PCB inspection system, advanced camera control for electronics QA, critical inspection solution for biopharmaceutical production
Domain-specific keywords: molecular diagnostics equipment, biotechnology inspection tools, biomedical engineering imaging, synthetic biology quality control
Item Stats
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Ph.D. Hsin-Wen Liang
Northeastern UniversityFrom €13,715.69*ex. VAT
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