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Inspectis Microscope 90º Side-View BGA Small Lens BGA-005 / BGA-005-XM
Product Description
The Inspectis Microscope 90º Side-View BGA Small Lens is a specialized optical inspection accessory engineered for high-precision side-view imaging of concealed solder joints on Ball Grid Array (BGA), microBGA (µBGA), FlipChip, Chip Grid Array (CGA), Chip Scale Package (CSP), Surface Mount Devices (SMD), and other surface-mounted electronic components. This lens system is essential for electronics inspection, board-level quality control, and semiconductor analysis workflows, particularly in biotechnology applications involving molecular diagnostics and biomanufacturing where reliable solder joint inspection ensures device integrity.
Key technical features include:
- Two lens variants:
- BGA-005 (Standard Small Lens) with magnification range approximately 36× to 300× on a 28″ monitor
- BGA-005-XM (Extended Magnification Small Lens) offering approximately 55× to 370× magnification
- Working distance:
- Small Lens: ~0.5 mm to 100 mm focusing range
- XM Small Lens: ~0.3 mm to 20 mm focusing range
- Field of View (FoV):
- Small Lens: ~2 mm to 16.5 mm
- XM Lens: ~1.6 mm to 11 mm
- Compact footprint: Requires only ~0.8 mm free working area, enabling inspection of tight stand-off regions inaccessible by top-down lenses.
- Precision 90º side-view optics: Designed for imaging hidden and underside features on complex semiconductor packages, critical for applications in live-cell imaging equipment assembly and bioprocessing instrumentation.
- Industrial-grade Swedish manufacturing: Guarantees durability and optical clarity suitable for rigorous production and R&D environments.
- Warranty: 2-year limited warranty
These side-view lenses are widely adopted among electronics engineers and researchers working on synthetic biology devices and advanced microfabricated systems, offering a clear visualization of features down to approximately 40 µm stand-off distances. They are compatible as replacements or supplementary optics within the Inspectis BGA inspection platform ecosystem. This product supports critical inspection tasks in biotechnology-driven semiconductor device manufacturing and quality assurance pipelines.
Ideal for lab professionals requiring precise inspection of microelectronic assemblies where microscopic imaging of hidden solder joints is essential to ensuring device performance and reliability.
Item Stats
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Ph.D. Hsin-Wen Liang
Northeastern UniversityFrom €4,900.27*ex. VAT
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